发明名称 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING SYSTEM
摘要 <p>In the present invention, on the basis of a relative positional relationship with respect to an electrode corresponding to solder on a substrate, a target fitting position of a component, and a correction value for the target fitting position, the orientation of positional displacement with respect to the electrode corresponding to the solder and the orientation of the correction of the target fitting position according to the correction value are simultaneously displayed on a display device. It is determined, for a component in which a fitting defect has occurred after component fitting, whether the cause of the fitting defect is in the process for detecting the position of the solder, the process for calculating the correction value, or the process for fitting the component.</p>
申请公布号 WO2014041713(A1) 申请公布日期 2014.03.20
申请号 WO2013JP01454 申请日期 2013.03.07
申请人 PANASONIC CORPORATION 发明人 NAKAMURA, MITSUO;ITOH, KATSUHIKO;NAGAI, DAISUKE
分类号 H05K13/04;H05K3/34;H05K13/08 主分类号 H05K13/04
代理机构 代理人
主权项
地址