发明名称 RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER
摘要 <p>Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass fiber having an average fiber length of 200 µm or less and 2 to 20 parts by weight of a laser direct structuring additive.</p>
申请公布号 WO2014042284(A1) 申请公布日期 2014.03.20
申请号 WO2013JP75387 申请日期 2013.09.12
申请人 MITSUBISHI ENGINEERING-PLASTICS CORPORATION 发明人 MOTEGI, ATSUSHI;MARUYAMA, HIROYOSHI
分类号 C08L69/00 主分类号 C08L69/00
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