| 摘要 |
In the present invention, semiconductor device heat dissipation is improved. Through the fastening of a semiconductor device (10) and a heat dissipating member (80), in the semiconductor device (10), a force acts on the heat dissipating member (80) from a metal substrate (40) in the drawing downward- direction, with an edge (52) of a housing region (51) acting as a support point with respect to the heat dissipating member (80). Consequently, a heat conducting material (81) between the metal substrate (40) and the heat dissipating member (80) is spread more thinly and heat dissipation between the metal substrate (40) and the heat dissipating member (80) is improved. Furthermore, the heat conducting material (81), which has spread to the outside of the metal substrate (40), fills in the periphery of the metal substrate (40), making it possible to prevent a decrease in heat dissipation by increasing the airtightness of the periphery of the metal substrate (40) and suppressing the mixing-in of air bubbles and the like. Thus, improved is the heat dissipation of the semiconductor device (10) to which the heat dissipating member (80) is attached. |
