| 摘要 |
PROBLEM TO BE SOLVED: To provide a communication module and a communication apparatus which conduct heat generated from a circuit component to a radiator and allows secure electrical connection between a connector of the communication module and a mating connector.SOLUTION: The communication module comprises: a first substrate 27 on which an optical element array 26 and a semiconductor circuit element 25 are mounted; a male connector 21 provided on an end of a second substrate 28; and a heat transmission member 4 conducting heat generated from the optical element array 26 and the semiconductor circuit element 25 to a radiator 7. The heat transmission member 4 includes: a heat absorption part 40 absorbing the heat generated from the optical element array 26 and the semiconductor circuit element 25; a heat radiation part 42 in contact with the radiator 7; and a transmission part 41 conducting the heat absorbed by the heat absorption part 40 to the heat radiation part 42. The heat radiation part 42 projects to a direction intersecting with the first substrate 27 and the second substrate 28, and is brought into contact with the radiator 7 by fitting of the male connector 21 and a female connector 3 to regulate a relative displacement between the male connector 21 and the female connector 3. |
