发明名称 METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSING DEVICE
摘要 The present invention provides a method of more efficiently producing a semiconductor epitaxial wafer, which can suppress metal contamination by achieving higher gettering capability. A method of producing a semiconductor epitaxial wafer 100 according to the present invention includes a first step of irradiating a semiconductor wafer 10 with cluster ions 16 to form a modifying layer 18 formed from a constituent element of the cluster ions 16 in a surface portion 10A of the semiconductor wafer; and a second step of forming an epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer 10.
申请公布号 US2014080247(A1) 申请公布日期 2014.03.20
申请号 US201214116318 申请日期 2012.03.19
申请人 KADONO TAKESHI;KURITA KAZUNARI;SUMCO CORPORATION 发明人 KADONO TAKESHI;KURITA KAZUNARI
分类号 H01L21/02;H01L27/146;H01L29/36 主分类号 H01L21/02
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