| 摘要 |
A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units. |
