| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable silicone composition that is excellent in transparency and forms a cured product excellent in thermal shock resistance and to provide a photosemiconductor device produced by using the composition that is excellent in reliability.SOLUTION: The curable silicone composition is a hydrosilylation reaction curable silicone composition for encapsulating, coating and adhesively bonding a photosemiconductor element and contains one or more kinds of compounds selected from triazole compounds other than benzotriazole. For example, the curable silicone composition includes (A) an organopolysiloxane having two or more aliphatic unsaturated hydrocarbon groups in one molecule, (B) an organopolysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, (C) one or more kinds of compounds selected from triazole compounds other than an unsubstituted benzotriazole and (D) a hydrosilylation reaction catalyst. |
