PHOTOSENSITIVE RESIN COMPOSITION AND PRINTED WIRING BOARD HAVING CURED FILM OF PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that gives a cured product having excellent characteristics in folding property (flexibility) and low warpage property without degrading various characteristics such as developing property, flame retardancy and insulating property.SOLUTION: The photosensitive resin composition comprises: an alkali-soluble resin (A) which is obtained by adding a (d) polybasic acid anhydride to a reaction product of (a) an epoxy resin having two or more epoxy groups in one molecule, (b) at least one aliphatic acid having 10 or more carbon atoms per one carboxyl group and (c) a carboxylic acid containing an ethylenically unsaturated group; and a photopolymerization initiator (B).