发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device which makes the attachment accuracy of an electronic component less likely to be deteriorated.SOLUTION: An electronic component mounting device 1 includes: a component supply unit 2 holding an electronic component P; a component attachment unit 3 which is disposed independently of the component supply unit 2 and attaches the electronic component P to a substrate B; and attachment heads 60a to 60d which reciprocate between the component supply unit 2 and the component attachment unit 3 to transfer the electronic component P.
申请公布号 JP2014053419(A) 申请公布日期 2014.03.20
申请号 JP20120196317 申请日期 2012.09.06
申请人 FUJI MACH MFG CO LTD 发明人 YASUI YOSHIHIRO;ITO HIDETOSHI;KURODA HIDEYA;KANDA TOMOHISA;TOTANI SIBAYOSHI;IWASAKI MASATAKA
分类号 H05K13/04 主分类号 H05K13/04
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