发明名称 |
ELECTRONIC COMPONENT MOUNTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting device which makes the attachment accuracy of an electronic component less likely to be deteriorated.SOLUTION: An electronic component mounting device 1 includes: a component supply unit 2 holding an electronic component P; a component attachment unit 3 which is disposed independently of the component supply unit 2 and attaches the electronic component P to a substrate B; and attachment heads 60a to 60d which reciprocate between the component supply unit 2 and the component attachment unit 3 to transfer the electronic component P. |
申请公布号 |
JP2014053419(A) |
申请公布日期 |
2014.03.20 |
申请号 |
JP20120196317 |
申请日期 |
2012.09.06 |
申请人 |
FUJI MACH MFG CO LTD |
发明人 |
YASUI YOSHIHIRO;ITO HIDETOSHI;KURODA HIDEYA;KANDA TOMOHISA;TOTANI SIBAYOSHI;IWASAKI MASATAKA |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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