SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND SUBSTRATE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be thinned all over and easily manufactured and which is inexpensive, and provide a manufacturing method of the semiconductor device, a substrate for a semiconductor device and a manufacturing method of the same.SOLUTION: A semiconductor device 10 comprises: a plurality of terminal parts 13 each having an inner terminal surface 13b and an external terminal part 13a; a die pad 12; a semiconductor element 15 mounted on the die pad 12; and an encapsulation resin part 11 for encapsulating the die pad 12, the terminal parts 13, the semiconductor element 15 and connection parts 17. The external terminal surface 13a of each terminal part 13 and an exterior surface 12a of the die pad 12 lie in the same plane. Each terminal part 13 includes a nickel layer 13c and a noble metal plating layer 13f for bonding composed of a gold layer 13d and a silver layer 13e. A total thickness of the noble metal plating layer 13f is such a thickness that a surface of the noble metal plating layer 13f maintains a rough surface 13R of the nickel layer 13c.