发明名称 POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE
摘要 A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.
申请公布号 US2014078684(A1) 申请公布日期 2014.03.20
申请号 US201314078622 申请日期 2013.11.13
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 KUROMITSU YOSHIROU;AKIYAMA KAZUHIRO;KITAHARA TAKESHI;TONOMURA HIROSHI
分类号 H05K1/05;H05K7/06 主分类号 H05K1/05
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