发明名称 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 A light emitting device package according to an embodiment of the present invention includes: a base having at least one recess; at least one light emitting device mounted inside the recess; and a reflection wall filling the space between the recess and the light emitting device to enclose a side surface of the light emitting device, wherein the recess can be formed with a height range of +20% to -20% of the height of the light emitting device.
申请公布号 KR20140034496(A) 申请公布日期 2014.03.20
申请号 KR20120100874 申请日期 2012.09.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUNG HOON;PARK, IL WOO
分类号 H01L33/48;H01L33/54;H01L33/60 主分类号 H01L33/48
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