发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A light emitting device package according to an embodiment of the present invention includes: a base having at least one recess; at least one light emitting device mounted inside the recess; and a reflection wall filling the space between the recess and the light emitting device to enclose a side surface of the light emitting device, wherein the recess can be formed with a height range of +20% to -20% of the height of the light emitting device. |
申请公布号 |
KR20140034496(A) |
申请公布日期 |
2014.03.20 |
申请号 |
KR20120100874 |
申请日期 |
2012.09.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JUNG HOON;PARK, IL WOO |
分类号 |
H01L33/48;H01L33/54;H01L33/60 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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