| 发明名称 |
EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE |
| 摘要 |
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound. |
| 申请公布号 |
KR20140034804(A) |
申请公布日期 |
2014.03.20 |
| 申请号 |
KR20137032049 |
申请日期 |
2012.05.10 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
HAMADA MITSUYOSHI;FURUSAWA FUMIO;IKEZAWA RYOICHI;TAKEMIYA KEIZO;BABA TORU |
| 分类号 |
C08L63/00;C08G59/18;C08K3/00;C08K5/5435;C08K5/544;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
| 代理机构 |
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