发明名称 LIGHT EMITTING DEVICE PACKAGE AND HEADLIGHT FOR VEHICLE HAVING THE SAME
摘要 A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.
申请公布号 US2014078763(A1) 申请公布日期 2014.03.20
申请号 US201313926241 申请日期 2013.06.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK HEE SEOK;WANG JI SEOK;KIM KWON JIN;KIM HEE DONG
分类号 H01L33/50;F21S8/10 主分类号 H01L33/50
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