RADIATION EFFICIENT INTEGRATED ANTENNA

摘要

An apparatus includes a dielectric slab (110) having first and opposing second major surfaces. A planar antenna element (140) is located on the first major surface. A via (150,160) formed through the dielectric slab is conductively connected to the antenna element. A plurality of solder bump pads is located on the second major surface and is configured to attach the dielectric slab to an integrated circuit (200).