ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

摘要

Provided are an electronic device and a manufacturing method thereof. An electronic device comprises a base plate (201), with a ground layer provided in the base plate (201); a first electronic element (202) and a second electronic element (203) provided on the base plate (201); a metallic shield wall (204) provided between the first electronic element (202) and the second electronic element (203); a plastic packaging glue (205) covering the first electronic element (202), the second electronic element (203) and the metallic shield wall (204), wherein there is an opening on the plastic packaging glue (205) and only the metallic face on the top of the shield wall (204) is exposed from the opening; and a conductive thin film (206) covering the metallic face on the top of the shield wall (204) and the plastic packaging glue (205), and being electrically connected to the ground layer of the base plate (201). The electronic device and the manufacturing method thereof can provide a better effect for shielding electromagnetic interference and save packaging costs for shielding an electronic device from electromagnetic interference.