发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition capable of providing a pattern excellent in adhesion property to a substrate.SOLUTION: The curable resin composition contains a resin (A), a resin (B), a polymerizable compound (C), a polymerization initiator (D) and a solvent (E). The resin (A): a resin containing a structural unit derived from at least one kind selected from a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a structural unit derived from a monomer having a cyclic ether structure having 2 to 4 carbon atoms and an ethylenically unsaturated bond and having an epoxy equivalent of 200 g/eq to 500 g/eq. The resin (B): a resin containing a structural unit derived from at least one kind selected from a group consisting of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, and a structural unit derived from the monomer having the cyclic ether structure having 2 to 4 carbon atoms and the ethylenically unsaturated bond and having the epoxy equivalent of 1,200 g/eq to 2,600 g/eq.
申请公布号 JP2014051659(A) 申请公布日期 2014.03.20
申请号 JP20130164876 申请日期 2013.08.08
申请人 SUMITOMO CHEMICAL CO LTD 发明人 INOUE KATSUJI;TAKAHASHI YOICHI;SHIRAKAWA MASAKAZU
分类号 C08L63/00;C08K5/33;C08K5/3445;C08L101/06;G03F7/031;G03F7/032 主分类号 C08L63/00
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