发明名称 |
THERMALLY CONDUCTIVE PLASTIC COMPOSITIONS, EXTRUSION APPARATUS AND METHODS FOR MAKING THERMALLY CONDUCTIVE PLASTICS |
摘要 |
A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic. |
申请公布号 |
US2014080952(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201313829225 |
申请日期 |
2013.03.14 |
申请人 |
MOMENTIVE PERFORMANCE MATERIALS INC. |
发明人 |
RAMAN CHANDRASHEKAR;XIANG BEI;MURUGAIAH ANAND |
分类号 |
C08K13/02;C08K3/22;C08K3/38;C08K5/54 |
主分类号 |
C08K13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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