发明名称 THERMALLY CONDUCTIVE PLASTIC COMPOSITIONS, EXTRUSION APPARATUS AND METHODS FOR MAKING THERMALLY CONDUCTIVE PLASTICS
摘要 A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
申请公布号 US2014080952(A1) 申请公布日期 2014.03.20
申请号 US201313829225 申请日期 2013.03.14
申请人 MOMENTIVE PERFORMANCE MATERIALS INC. 发明人 RAMAN CHANDRASHEKAR;XIANG BEI;MURUGAIAH ANAND
分类号 C08K13/02;C08K3/22;C08K3/38;C08K5/54 主分类号 C08K13/02
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