LED lighting device manufacturing method, involves covering LED chip with converter layer, filling matrix material in converter layer, roughening surface of LED chip, and applying adhesion promoter on surface of LED chip

摘要

The method involves covering an LED chip (2) with a converter layer (12). A matrix material i.e. phosphor particle, is filled in the converter layer. A surface (9, 11) of the LED chip is roughened. A covalent attachment of the converter layer is amplified at the surface of the LED chip. An adhesion promoter is applied on the surface of the LED chip. The converter layer is made of a polyurethane polyacrylate. An independent claim is also included for an LED lighting device.