| 摘要 |
The present invention provides a circuit substrate module capable of being stably mounted on a substrate (motherboard) of an electric device, electronic device, etc., it being possible for the circuit substrate module to be strongly joined to the substrate. The present invention provides a first insulating substrate on which are formed a mounting part to which a chip component is mounted and a wiring pattern to which the chip component is electrically connected, a frame-shaped substrate formed on the periphery of the mounting part of the first insulating substrate, and a second insulating substrate having a terminal electrode formed on the rear surface. A circuit substrate module in which the wiring pattern and the terminal electrode are electrically connected via a through-hole provided through the first insulating substrate, the frame-shaped substrate, and the second insulating substrate. |
