| 摘要 |
The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications. |
