| 摘要 |
A polishing apparatus is used for polishing and planarizing a surface of a substrate such as a semiconductor wafer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate and press the substrate against the polishing surface. The top ring has an extendable and contractable connection sheet configured to cover a gap between a retainer ring guide fixed to a top ring body and a retainer ring guided by the retainer ring guide to move vertically. The polishing apparatus has a nozzle configured to eject a cleaning liquid in a horizontal direction toward the connection sheet and apply a flow of the cleaning liquid directly onto the connection sheet for cleaning the connection sheet. |
