| 摘要 |
An electronic apparatus comprises a case, a circuit board, a heat sink, a heat pipe and a fan. The case includes a first wall which is provided with an input unit for receiving an input operation and a top surface and a second wall which is opposed to the first wall. Both the heat sink and the circuit board are housed in the case, where the circuit board is mounted with a heat generation body. The heat pipe is configured to thermally connect the heat generation body and the heat sink while the fan includes an air discharge outlet which is directed to the heat sink. According to one embodiment, the first wall includes a slant portion which inclines with respect to the top surface and extends toward the second wall and is provided with a first air inlet, and the second wall includes a second air inlet. |
