LAMINATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminated semiconductor device that allows solving the defects occurring when a semiconductor chip smaller than an adhesive layer of the semiconductor chip is buried in the adhesive layer.SOLUTION: A laminated semiconductor device 1 includes: a first semiconductor chip 6 disposed above a circuit board 2; an adhesive layer 7 firmly fixing the first semiconductor chip 6 to the circuit board 2; and a second semiconductor chip 10 having a smaller outer shape than the first semiconductor chip 6. At least a part of the second semiconductor chip 10 is buried in the adhesive layer 7. The adhesive layer 7 has a thickness ranging from 95 μm or more to 150 μm or less, and includes a thermosetting resin having thermal time viscosity ranging from 500 Pa*s or more to 5000 Pa*s or less when the second semiconductor chip 10 is buried.