| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation characteristics measurement method of a semiconductor module device which can measure heat radiation characteristics of the semiconductor module device in a shorter time and at lower costs.SOLUTION: The heat radiation characteristics measurement method of a semiconductor module device includes a semiconductor module 2 having a semiconductor 2b, and a cooler 4 cooling the semiconductor module 2, and measures, as a test object, a semiconductor module device 1 including insulation layers 9-11 interposed between the semiconductor 2b and the cooler 4. The heat radiation characteristics measurement method includes the steps of: applying a predetermined voltage between an electrode of the semiconductor 2b and the cooler 4 to measure current flowing between the electrode of the semiconductor 2b and the cooler 4 in application of the voltage; determining that heat resistance is excessively high when a measured value of the current is lower than a first specified value, and determining that the heat resistance is within a proper range when the measured value is equal to or greater than the first specified value. |
