发明名称 |
EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD |
摘要 |
Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg. |
申请公布号 |
US2014077129(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201313780988 |
申请日期 |
2013.02.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOON JIN SEOK;YOO SEONG HYUN;LEE KEUN YONG;LEE HYUN JUN |
分类号 |
H01B3/40 |
主分类号 |
H01B3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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