发明名称 POLISHING MATERIAL REDUCED IN GRANULARITY VARIATION BETWEEN PARTICLES AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polishing material particle having variation of a grain diameter smaller than that of a conventional particle even though the particle diameter is relatively large, and to provide a method for manufacturing the polishing material particle and a polishing and cutting work tool using the polishing material particle.SOLUTION: A polishing material particle having small variation of a grain diameter is obtained by using a plate sieve where a polygonal shape hole is formed on plate material, to select granularity of a polishing material particle.
申请公布号 JP2014050939(A) 申请公布日期 2014.03.20
申请号 JP20120198417 申请日期 2012.09.10
申请人 SHINGIJUTSU KAIHATSU KK 发明人 ISHIZUKA HIROSHI
分类号 B24D3/00 主分类号 B24D3/00
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