发明名称 IMPROVED BONDING COMPOSITIONS
摘要 There is provided a curable composition comprising one or more reactive components that cure upon exposure to suitable conditions, the curable composition comprising: (i) at least one aromatic nitroso or at least one aromatic nitroso precursor compound or combinations thereof; and (ii) a film former component comprising at least one non-halogenated hydroxy group-containing resin together with at least one crosslinking agent.
申请公布号 WO2014040644(A1) 申请公布日期 2014.03.20
申请号 WO2012EP68148 申请日期 2012.09.14
申请人 HENKEL IRELAND LIMITED;NOLAN, DARREN;FLEMING, EIMEAR;LEDWITH, DEIRDRE;KNEAFSEY, BRENDAN;WALSH, JOHN;FINNIGAN, EIMEAR 发明人 NOLAN, DARREN;FLEMING, EIMEAR;LEDWITH, DEIRDRE;KNEAFSEY, BRENDAN;WALSH, JOHN;FINNIGAN, EIMEAR
分类号 C08K5/32;C08K5/54;C08K5/5435;C08K5/544;C08L1/14;C08L29/14;C09J101/14;C09J129/14 主分类号 C08K5/32
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