SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND HEAT-RELEASING MODULE

摘要

The invention provides a substrate, including: a metal foil; a polyimide resin layer having an average thickness of from 3μm to 25μm, the polyimide resin layer being disposed on a surface of the metal foil having an arithmetic average roughness (Ra) of 0.3μm or less and a maximum roughness (Rmax) of 2.0μm or less; and an adhesive layer having an average thickness of from 5μm to 25μm, the adhesive layer being disposed on the polyimide resin layer.