发明名称 PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board including a circuit layer having durability against heat generated at the time of irradiation of laser light.SOLUTION: To eliminate a risk of a circuit layer 120 being penetrated at the time of irradiation of laser, a printed circuit board 100 includes: an insulating layer 110; a circuit layer 120 formed on one surface of the insulating layer 110; and a via electrode 130 penetrating through the insulating layer 110 and being connected with the circuit layer 120. The circuit layer 120 is formed in a structure where different kinds of metal layers 121, 122 with thermal conductivity different from each other are laminated.
申请公布号 JP2014053604(A) 申请公布日期 2014.03.20
申请号 JP20130174224 申请日期 2013.08.26
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 SHIN GIL YONG;KIM SEUNG RAK;YUN KYON RO
分类号 H05K3/46 主分类号 H05K3/46
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