发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 According to one embodiment, a semiconductor device includes a semiconductor substrate including a drain layer of a first conductivity type and a base layer of a second conductivity type provided on the drain layer, a gate electrode including a first portion formed in the semiconductor substrate, a gate insulating layer provided between the gate electrode and the semiconductor substrate, an upper insulating layer formed on the gate electrode, a source layer of the first conductivity type that is provided on a sidewall of the upper insulating layer and whose width increases towards the base layer, and a source electrode provided on the source layer.
申请公布号 US2014077292(A1) 申请公布日期 2014.03.20
申请号 US201313849438 申请日期 2013.03.22
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NOGAMI TAKUYA;OKUMURA HIDEKI;KAWANO TAKAHIRO
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
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