PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high transparency and excellent heat resistance and light resistance, and to provide a photosensitive film and a method for manufacturing a circuit board using the composition.SOLUTION: The photosensitive resin composition comprises (A) an acrylic resin, (B) a polymerizable compound, (C) a photopolymerization initiator and (D) a hindered phenol-based antioxidant, in which the content percentage of an aromatic ring-containing compound and a structural unit derived from an aromatic ring-containing compound is 0.01 to 5 mass% with respect to the total amount of the (A) to (D) components.