| 摘要 |
PROBLEM TO BE SOLVED: To provide a means capable of enhancing all the more a polishing speed with respect to a polishing composition used for a purpose of polishing a polishing object containing a metal element or a metalloid element.SOLUTION: The means includes causing a polishing composition used for a purpose of polishing a polishing object containing a metal element or a metalloid element to contain an oxo acid containing the metal element or the metalloid element, and water. |
