发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can obtain a good quality film having less crystal grain boundary; and provide a semiconductor manufacturing apparatus used for the semiconductor device manufacturing method.SOLUTION: In a semiconductor device manufacturing method of the present embodiment, a crystal film is formed on a semiconductor substrate by irradiation of a first microwave obtained by frequency modulation or phase modulation of a first carrier wave which is a sine wave having a first frequency by using a first signal wave which is a sine wave or a pulse wave having a third frequency lower than the first frequency and a second microwave obtained by frequency modulation or phase modulation of a second carrier wave which is a sine wave having a second frequency higher than the first frequency by using a second signal wave which is a sine wave or a pulse wave having a fourth frequency lower than the second frequency.
申请公布号 JP2014053380(A) 申请公布日期 2014.03.20
申请号 JP20120195474 申请日期 2012.09.05
申请人 TOSHIBA CORP 发明人 SUGURO KYOICHI
分类号 H01L21/20;H01L21/268 主分类号 H01L21/20
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