发明名称 INTEGRATED CIRCUIT
摘要 An integrated circuit includes a first standard cell over a substrate, a power rail, and a first connection plug. The first standard cell includes an active area, at least one gate electrode overlapping the active area of the first standard cell, and at least one metallic line structure overlapping the active area of the first standard cell. The at least one metallic line structure is substantially parallel to the gate electrode. The power rail is substantially orthogonal to the at least one metallic line structure of the first standard cell. The power rail overlaps the at least one metallic line structure of the first standard cell, and the power rail has a flat edge extending through the first standard cell. The first connection plug is at a region where the power rail overlaps the at least one metallic line structure of the first standard cell.
申请公布号 US2014077270(A1) 申请公布日期 2014.03.20
申请号 US201314084823 申请日期 2013.11.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LU LEE-CHUNG;TIEN LI-CHUN;ZHUANG HUI-ZHONG;HUANG MEI-HUI
分类号 H01L27/02 主分类号 H01L27/02
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