发明名称
摘要 <p>A sealing member for an electronic component package includes, on another principal surface of a base material (4) constituting the sealing member for the electronic component package, an external terminal electrode (53,54), a wiring pattern (55), and a resin material (99). The external terminal electrode (53,54) is to be electrically coupled to an outside of the electronic component package. The wiring pattern (55) is configured to couple an electronic component element (2) on one principal surface (42) of the base material (4) to the external terminal electrode (53,54). The resin material (99) is layered over the other principal surface (43) and the wiring pattern (55). The external terminal electrode (53,54) is layered over the wiring pattern (55) and the resin material (99).</p>
申请公布号 JP5447316(B2) 申请公布日期 2014.03.19
申请号 JP20100211045 申请日期 2010.09.21
申请人 发明人
分类号 H01L23/04 主分类号 H01L23/04
代理机构 代理人
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