摘要 |
<p>A LED package comprises:
- a LED chip (1) having an optically active layer on a substrate,
- a submount, on a central membrane of which the LED chip (1) is mounted in close thermal contact to the material of the submount,
the thickness of the membrane being less than 100 µm, preferably less than 80µm and the thickness of a frame of the submount which is integrally formed with the cavity, is substantially larger than the thickness of the cavity.</p> |