发明名称 |
SCALABLE HIGH-BANDWIDTH CONNECTIVITY |
摘要 |
A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly. |
申请公布号 |
EP2707968(A2) |
申请公布日期 |
2014.03.19 |
申请号 |
EP20120725566 |
申请日期 |
2012.05.14 |
申请人 |
WAVECONNEX, INC. |
发明人 |
MCCORMACK, GARY, D.;KYLES, IAN, A. |
分类号 |
H04B5/00;G06K19/07;G06K19/077;H01L25/065;H05K1/14 |
主分类号 |
H04B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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