发明名称 |
Fabrication of replacement metal gate devices |
摘要 |
A polishing method includes polishing, in a first polish, a wafer to remove overburden and planarize a top layer leaving a portion remaining on an underlying layer. A second polishing step includes two phases. In a first phase, the top layer is removed and the underlying layer is exposed, with a top layer to underlying layer selectivity of between about 1:1 to about 2:1 to provide a planar topography. In a second phase, residual portions of the top layer are removed from a top of the underlying layer to ensure complete exposure of an underlying layer surface. |
申请公布号 |
GB2497253(B) |
申请公布日期 |
2014.03.19 |
申请号 |
GB20130005907 |
申请日期 |
2011.10.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;JSR CORPORATION |
发明人 |
TAKASHI ANDO;LESLIE CHARNS;JASON E CUMMINGS;JUKASZ J HUPKA;DINESH KOLI;TOMOHISA KONNO;MAHADEVAIYER KRISHNAN;MICHAEL F LOFARO;JAKUB W NALASKOWSKI;MASAHIRO NODA;DINESH K PENIGALAPATI;TATSUYA YAMANAKA |
分类号 |
H01L21/336;H01L21/28;H01L21/3105;H01L21/311;H01L29/66 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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