发明名称
摘要 PROBLEM TO BE SOLVED: To enhance a heat dissipation effect capable of radiating generated heat of an LED even from a design plate which is not used as a heat dissipation member by integrally forming the same with a heat sink using the same member.SOLUTION: The lighting system 100 includes an LED substrate 112 and a heat sink 120 with a design plate. The LED substrate 112 is provided with a mounting surface 112A of an LED, and a backside 112B which is an opposite side of the mounting surface 112A. The heat sink 120 with a design plate is provided with a flat part 123 formed of a thin plate material with thermal conductivity, and having a flat area adhering with the backside 112B, a first wall 124A as well as a second wall 124B which is an erected part erected from the flat part 123 toward a Y direction and continuously formed from the flat part 123, and a design plate part 120A continuously formed from the erected parts, and covering peripheries of the LED substrate 112, as a direction of the mounting surface 112A is seen from a direction opposite to the Y direction.
申请公布号 JP5449273(B2) 申请公布日期 2014.03.19
申请号 JP20110181644 申请日期 2011.08.23
申请人 发明人
分类号 F21V29/00;F21S2/00;F21V7/00;F21V19/00;F21Y101/02 主分类号 F21V29/00
代理机构 代理人
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