| 摘要 |
Disclosed is a printed circuit board for an optical proximity sensor which senses proximity of an object in a contactless manner using a light emitting device emitting light and a light receiving device receiving the light reflected by the near object. The printed circuit board comprises: a flat plate-shaped substrate; a first mounting pad and a second mounting pad which are arranged on the top surface of the substrate to be spaced apart from each other, and on which the light emitting device and the light receiving device are mounted respectively; a first bonding pad and a second boding pad which are arranged on the top surface of the substrate to be close to the first mounting pad and the second mounting pad respectively and to bond a wire to each of the light emitting device and the light receiving device; and a first shielding film for covering at least an edge portion of a first molding area in which the light emitting device is molded and an edge portion of a second molding area in which the light receiving device is molded in the top surface of the substrate. |
