| 摘要 |
<p>The present invention relates to a carrier head of a chemical mechanical polishing (CMP) device and a monitoring method using the same. The carrier head of the chemical mechanical polishing device includes a carrier head housing; retaining rings retaining a polishing target wafer in an inner space by being connected to the lower part of the carrier head housing; a circular groove included between the lower surface of the carrier head housing and the upper surface of the retaining rings and maintaining a sealed space by being formed in a radial direction of the carrier head housing; one or more air paths forming a path to inject or sucking air by passing through the inside of the carrier head housing and connecting a manifold assembly located at the upper part of the carrier head and the circular groove; and a plurality of connection members connecting the carrier head housing and the retaining rings by being coupled to a plurality of connection holes connected to the circular groove. According to the present invention, the carrier head of the chemical mechanical polishing device can improve air tightness and working efficiency by reducing working man hours and manufacturing costs without a fixing unit to fix a cover as it does not need to include a cover as in the past. The present invention also allows a user to easily perform maintenance by simplifying a structure.</p> |
