发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat transport unit and an electronic instrument capable of transporting at a high speed a heat taken from a heating element, while being able to flexibly correspond to any kind of the heating element used as a cooling object. <P>SOLUTION: A heat transport unit 1 is constituted by an upper portion plate 2 and a lower portion plate 3 facing to the upper portion plate 2, and is formed by bonding the upper portion plate 2 and the lower portion plate 3. The heat transport unit 1 is provided with: an internal space 4 in which a cooling medium can be enclosed; plural passages 5 constituted by partitioning the internal space 4 along the first direction; grooves 7 which are formed in the first direction in at least a part of an inner wall of each of the plural passages 5; and contact paths 8 by which the cooling medium can move through the plural passages 5 comrades. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5449801(B2) 申请公布日期 2014.03.19
申请号 JP20090050115 申请日期 2009.03.04
申请人 发明人
分类号 H01L23/427;F28D15/02 主分类号 H01L23/427
代理机构 代理人
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