| 摘要 |
<p>1,234,606. Welding by pressure. WESTERN ELECTRIC CO. Inc. 14 June, 1968 [15 June, 1967], No. 28348/68. Heading B3R. In bonding leads extending from an electrical device to conductive areas on a substrate the device is positioned in a recess in a bonding tool so that the leads project over a bonding surface of the tool, the tool is positioned with respect to a substrate mounted on a support means so that the leads are in registration with respective areas on the substrate and an undulatory relative motion is produced between the tool and substrate so that bonding pressure is applied successively to each lead. A bonding apparatus comprising a heated bonding tool 11 formed by a rectangular rod 12 having a recess 13 at its lower end to accommodate an electrical device by suction provided through a tube 16 and having a bonding face 15 formed by a rectangular border area perpendicular to the axis OX of the rod and a non-rotating plate 32 resting on bearings 33 in a rotating plate 34 on tilting and supporting means 35 is used to thermocompression bond the leads 23A to 23H extending from a semi-conductor integrated circuit device 21 to the bonding pads 27A to 27H of a circuit pattern on a substrate 26. The substrate is positioned on the non-rotating plate 32 forming part of a wobble table, so that the bonding pads are centred about the axis OX, the circuit device 21 held by suction in the recess of the tool is then placed on substrate 26 so that leads 23A-23H are aligned with pads 27A-27H and with the bonding tool forced against the leads by gravity or springs the plate 32 is tilted about a point defined by the intersection of axis OX and the upper surface of the substrate. The leads are rocked into contact with the bonding face 15 in succession to effect thermocompression bonds. The bonding face of the tool may be of a conic section rather than flat and instead of wobbling the table, the tool may be wobbled. A substrate may be mounted on a mechanism which can move the substrate from one bonding location to another, so that, with e.g. computer control, more than one integrated circuit may be bonded to a circuit pattern.</p> |
