| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a camera module which is to attain a thinned film of a camera module manufactured by a wafer processing, does not need human labor or the time and the effort in the manufacturing process, adopts a wafer processing in a process manner and can be simply and mass-produced, and to provide a manufacturing method of the camera module. SOLUTION: The camera module is formed, by using a lens base substance with an etching recessed section formed on a formation surface of a lens element and by laminating at least one lens body with the lens element formed in the etching recessed section of the lens base substance on a solid-state imaging element. The camera module is formed, by sticking sealing glass plates on the solid-state imaging element through a frame wall and by sticking a cover glass on the lens body. COPYRIGHT: (C)2011,JPO&INPIT |
