| 摘要 |
There is provided a substrate with a built-in semiconductor element, including: a first substrate at which a wiring layer is layered on a dielectric layer; a semiconductor element that is structured to include a distributed constant circuit, and at which plural bonding pads are formed at a peripheral region of a surface that faces the first substrate, and that is electrically connected to the wiring layer by an electrically-conductive member that has electrical conductivity and corresponds to the plural bonding pads; a supporting member that is disposed at an inner side region that is further toward an inner side than the peripheral region of the semiconductor element, and that is interposed between the semiconductor element and the first substrate and supports the semiconductor element; and a second substrate that is laminated to the first substrate and the semiconductor element. |
