WAFER ETCHING PROCESS AND USING THE SAME WAFER ETCHING SYSTEM

摘要

A wafer etching system and a wafer etching process using the same which are capable of smoothly manufacturing and transferring thin wafer by continuously installing a dry etching chamber and a transfer chamber between an existing wafer grinder and a tape mounter are disclosed. The wafer etching system comprises the steps of: a wafer grinding device for mechanically etching the wafer; an aligner for arraying the etched wafer; a dry etching device for repeatedly etching the wafer; a wafer transfer device for transferring the wafer between the aligner and the dry etching device; and a tape mounter for performing the taping work in the wafer in which the etching is completed from the dry etching device. The present invention is to provide a wafer etching system and a wafer etching process using the same which are capable of finishing a taping work after etching the wafer to be thin as the wafer; is manufactured to be thin while removing the stress remaining in the wafer by the mechanical etching by including the tape mounter for performing the taping work in the wafer in which the etching is completed from the dry etching device; and firstly mechanical grinding and capable of handling to prevent damage to the wafer when the wafer in which the thinly etched wafer is transferred.