发明名称 A stress relief assembly for semiconductor devices
摘要 <p>1,136,880. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORP. 25 July, 1967 [26 July, 1966], No. 34147/67. Heading H1K. A flexible seal 80 is used to hermetically join the cover 60 of a semi-conductor device container to the body 18 of the container. As shown the container comprises a studded base 12 of Cu, steel, &c., brazed to a steel tubular portion 18. The cover 60 is of an insulating ceramic such as alumina, or glass, the flexible seal comprising an annular bellows 80 of spring steel, brazed or welded to the adjacent parts. The device 22 is a 3-electrode PNPN switch of Si, Ge, SiC, or III-V or II-VI compounds, having an opening etched through one outer zone to permit a control electrode to be applied to an inner zone. The device 22 is supported by a disc 20 of Mo, W, Ta or base alloys thereof, and rings 44, 46 of Cu, Ag or base alloys thereof are applied to the upper device surface, the assembly being bonded together by brazing, soldering or pressure bonding. A lead 54 is connected to the control electrode. The container may be evacuated or filled with dry H 2 or an inert gas.</p>
申请公布号 GB1136880(A) 申请公布日期 1968.12.18
申请号 GB19670034147 申请日期 1967.07.25
申请人 WESTINGHOUSE ELECTRIC CORPORATION 发明人
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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