| 发明名称 |
LIGHT EMITTING DEVICE BONDED TO A SUPPORT SUBSTRATE |
| 摘要 |
A support substrate including a body (35) and a plurality of vias (48) extending through an entire thickness of the body is bonded to a semiconductor light emitting device including a light emitting layer (14) sandwiched between an n-type region (12) and a p-type region (16). The support substrate is no wider than the semiconductor light emitting device. |
| 申请公布号 |
KR20140034262(A) |
申请公布日期 |
2014.03.19 |
| 申请号 |
KR20137034940 |
申请日期 |
2012.05.22 |
| 申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
BHAT JEROME CHANDRA;AKRAM SALMAN;STEIGERWALD DANIEL ALEXANDER |
| 分类号 |
H01L33/00;H01L33/38;H01L33/44;H01L33/46;H01L33/62 |
主分类号 |
H01L33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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