| 发明名称 |
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
| 摘要 |
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. |
| 申请公布号 |
US8673539(B2) |
申请公布日期 |
2014.03.18 |
| 申请号 |
US201213672847 |
申请日期 |
2012.11.09 |
| 申请人 |
KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;YASUDA MASAAKI;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI;YASUDA MASAAKI |
| 分类号 |
G03F7/00;G03F7/26;G03F7/40 |
主分类号 |
G03F7/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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